Method and apparatus for dielectric filling of flip chip on interposer assembly

A semiconductor assembly comprising:

• a wafer including a plurality of unsingulated semiconductor dice, each of said semiconductor dice having an active surface and a back surface, said active surface of each of said dice having a plurality of conductive bumps thereon;
• a wafer scale interposer substrate comprising a dielectric member and including multiple unsingulated interposer substrates each arranged and dimensioned to correspond with one of said plurality of semiconductor dice, each of said interposer substrates having a first surface and a second surface, each of said plurality of interposer substrates having a plurality of recesses extending thereinto from the first surface, each recess exposing at least a portion of a conductive element at a bottom thereof, said wafer scale interposer substrate member mounted to said wafer with said conductive bumps on each of said semiconductor dice substantially received in said plurality of recesses in said interposer substrates, said plurality of recesses sized so that a gap is left adjacent a portion of at least some of said conductive bumps in said plurality of recesses, each of said interposer substrates including at least one opening in said dielectric member thereof in communication with said at least some of said gaps surrounding said at least some conductive bumps in said plurality of recesses;
• and
• a dielectric filler material extending from said at least one opening into said at least some of said gaps.

A method of assembling a flip chip semiconductor device assembly comprising:

• providing a semiconductor die having an active surface and a back surface, said active surface having a plurality of conductive bumps thereon;
• providing an interposer substrate having a first surface and a second surface, said interposer substrate having a dielectric member including a plurality of recesses extending thereinto from said first surface and exposing at least a portion of a conductive element at bottoms thereof, said interposer substrate including at least one opening in said dielectric member;
• mounting said interposer substrate to said semiconductor die with said plurality of conductive bumps substantially received in said plurality of recesses, said plurality of recesses sized so that a gap is left adjacent a portion of at least some of said conductive bumps in at least some of said plurality of recesses, said at least one opening in said interposer substrate extending to said gaps adjacent said at least some conductive bumps in said at least some recesses;
• and
• introducing a dielectric filler material in flowable form into said at least one opening in sufficient quantity to extend to said at least some of said gaps.

A method of assembling a flip chip semiconductor device assembly comprising:

• providing a semiconductor die having an active surface and a back surface, said active surface having a plurality of conductive bumps thereon;
• providing an interposer substrate having a first surface and a second surface, said interposer substrate including a plurality of recesses extending from said first surface thereinto and at least one opening extending to at least one of said plurality of recesses;
• mounting said active surface of said semiconductor die to said upper surface of said interposer substrate so that said conductive bumps are disposed in said plurality of recesses and leave a gap adjacent a portion of at least some of said conductive bumps within at least some of said plurality of recesses;
• and
• introducing a flowable material through said at least one opening sufficient to extend to and at least partially fill said at least some of said gaps.