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US 2003/0164538 A1Published application
Semiconductor device
OwnerKeisuke Matsunamiinventor
Life of this patent
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Abstract
The present invention provides a semiconductor device (1) which has a motherboard (20) as a base substrate, and an interposer (2) as an intermediate substrate which is arranged on the motherboard (20) via bumps (19). The interposer (2) has a semiconductor chip (15) arranged on a surface thereof facing the motherboard (20).
Claims3
A semiconductor device, comprising:
- a base substrate;
- and
- an intermediate substrate which is arranged on the base substrate via bumps;
- wherein the intermediate substrate has a chip arranged on a surface thereof facing the base substrate.
1 more element
Dependencies are inferred from the claim text.