Semiconductor component comprising a surface metallization
AssigneeOSRAM GmbH
InventorsHerbert Brunner, Thomas Hofer, Harald Jager
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Abstract
The invention relates to a semiconductor component comprising surface metallization and having at least one semiconductor body (3) and a package base body (2) on whose surface conductor path structures (7) are formed by means of surface metallization. A subregion of the conductor path structure (7) constitutes the solder connections of the semiconductor component. The solder connections (1) are combined to form rows, the individual rows of solder connections being arranged at a very small, predetermined spacing from one another.
Claims8
A semiconductor component having at least one semiconductor body (3) and a package base body (2) that comprises, for mounting the semiconductor component, a supporting surface on which a plurality of solder connections (1) is realized by means of surface metallization, said solder connections (1) being combined to form plural rows of solder connections, characterized in that
- said rows of solder connections are arranged at a spacing from one another that is suitably large to avert short circuits between said solder connections (1) and is sufficiently small to prevent damage to said surface metallization or said solder connections (1) as a result of thermally induced expansion of said package base body.
Dependencies are inferred from the claim text.