Lead frame manufacturing method
AssigneeShinko Electric Industries Co., Ltd.
InventorTatsuya Inatsugu
Life of this patent
Estimating the term…
Loading patent…
AssigneeShinko Electric Industries Co., Ltd.
InventorTatsuya Inatsugu
Estimating the term…
There are provided the steps of forming a plurality of opening portions by punching predetermined portions of a metal plate, forming crushed portions by pushing crushed margin portions, which are defined in vicinity of both side edge portions of the opening portions of the metal plate, to reduce a thickness, defining a width W3 between a side surface portion and a center portion to assure an interval between lead portions and also defining a width of a top end portion and a width of a base portion by punching center portions of the crushed portions except predetermined both-side portions and portions in vicinity of peripheral portions in which the crushed portions of the opening portions of the metal plate are not present, and defining the top end portions by punching a predetermined portion of the top end portion.
A lead frame manufacturing method of manufacturing a lead frame having lead portions, which extend inward from a frame portion like teeth of a comb and each of which has a base portion connected to the frame portion, a center portion connected to the base portion, and side surface portions connected to both side surfaces of the center portion to have a thickness that is smaller than other portions, by a stamping, comprising the steps of:
Dependencies are inferred from the claim text.