Non-destructive method for testing curing level of cured product of curable adhesive composition and manufacturing method of electronic devices
AssigneeSony Chemicals Corp.
InventorHiroyuki Kumakura
Life of this patent
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Abstract
In a method for non-destructively testing the curing level of the cured product of a curable adhesive composition, a fluorescent component that emits fluorescent light upon irradiation with excitation light is added to the curable adhesive composition, the curable adhesive composition containing this fluorescent component is cured, the cured product thus obtained is irradiated with excitation light, and the fluorescent light thus produced is observed to test the curing level of the cured product.
Claims4
A non-destructive method for testing the curing level of the cured product of a curable adhesive composition, wherein a fluorescent component that emits fluorescent light upon irradiation with excitation light is added to said curable adhesive composition, the curable adhesive composition containing this fluorescent component is cured, the cured product thus obtained is irradiated with excitation light, and the fluorescent light thus produced is observed to test the curing level of said cured product.
A method for manufacturing an electronic device consisting of a wiring board and electronic parts mounted thereon, comprising the steps of:
- (a) tacking temporarily the electronic parts to the wiring board via a curable adhesive composition, where this curable adhesive composition contains a fluorescent component that emits fluorescent light upon irradiation with excitation light;
- (b) then curing said curable adhesive composition;
- and
- (c) testing the curing level of the cured product by irradiating the cured product thus obtained with excitation light and observing the fluorescent light thus produced.
Dependencies are inferred from the claim text.