Indirect monitoring of semiconductor light source within a photonic package
AssigneeNetwork Elements, Inc.
InventorsDavid R. Ohm, Richard A. Booman
Life of this patent
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Abstract
A photonic package includes a housing having a semiconductor light source disposed within the housing. The semiconductor light source has a first output and a second output. A reflective surface is disposed inside the housing to reflect the second output from the semiconductor light source. A photodetector is also disposed within the housing and is adapted to indirectly receive the second output of the semiconductor light source reflected off the reflective surface. As a result, interior surface of a housing of an optical transponder may be utilized to provide reflected light to a photodetector to monitor the semiconductor light source.
Claims20
A photonic package comprising:
- a housing;
- a semiconductor light source disposed within the housing, the semiconductor light source having a first output and a second output;
- a reflective surface disposed inside the housing to reflect said second output;
- and
- a photodetector disposed within the housing adapted to indirectly receive said second output of the semiconductor light source reflected off said reflective surface.
A method for forming a photonic package comprising:
- providing a semiconductor light source to provide a first and a second output;
- providing a reflective surface to reflect the second output of the semiconductor light source;
- and
- adapting a photodetector to indirectly receive the second output of the semiconductor light source reflected from the interior surface.
Dependencies are inferred from the claim text.