Mounting method and device
OwnerTadatomo Suga, Akira Yamauchiinventors
Life of this patent
Estimating the term…
Abstract
A mounting method for bonding a first object having a metal joint part to a second object, comprising the steps of cleaning at least the surface of the metal joint part of the first object by irradiating an energy wave or energy particle beam, and thermally bonding the cleaned metal joint part of the first object to a portion to be bonded of the second object by heating in a special gas atmosphere, and a device thereof. In the mounting, the primary and secondary oxidations of the metal joint part can be efficiently prevented, and thereby highly reliable bonding can be carried out.
Claims10
A mounting method for bonding a first object having a metal joint part to a second object, comprising the steps of:
- cleaning at least a surface of said metal joint part of said first object by irradiating an energy wave or energy particle beam thereto;
- and
- thermally bonding the cleaned metal joint part of said first object to a portion to be bonded of said second object by heating in a special gas atmosphere.
A mounting device for bonding a first object having a metal joint part to a second object comprising:
- a cleaning means for cleaning at least a surface of said metal joint part of said first object by irradiating an energy wave or energy particle beam thereto,
- a heat bonding means for bonding said metal joint part of said first object cleaned by said cleaning means to a portion to be bonded of said second object by heating;
- and
- a gas atmosphere forming means for forming a special gas atmosphere around a portion to be thermally bonded by said heat bonding means.
Dependencies are inferred from the claim text.