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US 2003/0164247 A1Published application
Stacking multiple devices using direct soldering
OwnerChinh Nguyen, Phu Hoang +2inventors
InventorsChinh Nguyen, Phu Hoang, Phan Hoang, Andy Le
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Abstract
In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.
Claims24
An apparatus comprising:
- a printed circuit board (PCB) having a top side and a bottom side to attach to first pins of a first device to the top side;
- and
- a plurality of solder bumps on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.
A method comprises:
- attaching a printed circuit board (PCB) having a top side and a bottom side to first pins of a first device to the top side;
- and
- attaching a plurality of solder bumps on the bottom side to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.
A module comprising:
- a first device and a second device having first pins and second pins, respectively;
- and
- a stacking element to stack the first device on the second device, the stacking element comprising:
- a printed circuit board (PCB) having a top side and a bottom side to attach to the first pins of the first device to the top side, and
- a plurality of solder bumps on the bottom side and attached to upper areas of the second pins of the second device to provide electrical connections between the first pins and the second pins.
2 more elements
Dependencies are inferred from the claim text.