System for and method of interconnecting high-frequency transmission lines
AssigneeRyowa Electronics Co., Ltd.
InventorsYasunori Miyazawa, Katsuji Kaminishi
Life of this patent
Estimating the term…
Abstract
A cut via is formed in an end of a multilayer circuit board of the first transmission line, and a clearance is provided between the cut via and a ground pattern for achieving an impedance matching between the first and second transmission lines. The cut via of a first transmission line which may be a stripline or a microstrip line, and an electrode of the second transmission line are connected to each other, and ground patterns of the first and second transmission lines are connected to each other. The first and second transmission lines have respective signal lines positioned substantially coaxially with each other.
Claims11
A system for electrically interconnecting high-frequency transmission lines, comprising:
- a first transmission line comprising a multilayer circuit board having a ground pattern and a first signal line which jointly make up a stripline or a microstrip line;
- and
- a second transmission line having a second signal line and an electrode electrically connected to the second signal line;
- said first transmission line having a cut via defined in an end thereof and connected to said first signal line of said stripline or said microstrip line, said cut via formed by cutting a via hole;
- said first transmission line having a clearance defined between said cut via and said ground pattern for providing an impedance matching between characteristic impedances of said first and second transmission lines;
- said cut via of said first transmission line and said electrode of said second transmission line being connected to each other, said first and second transmission lines having ground conductors connected to each other.
A method of interconnecting high-frequency transmission lines in a system for electrically interconnecting high-frequency transmission lines including a first transmission line comprising a multilayer circuit board having a ground pattern and a first signal line which jointly make up a stripline or a microstrip line, and a second transmission line having a second signal line and an electrode electrically connected to the second signal line, said method comprising the steps of:
- defining a cut via in an end of said first transmission line, said cut via being connected to said first signal line of said stripline or said microstrip line, said cut via serving as an electrode comprising a partially cut form of a via hole;
- providing a clearance defined between said cut via and said ground pattern for providing an impedance matching between characteristic impedances of said first and second transmission lines;
- and
- connecting said cut via of said first transmission line and said electrode of said second transmission line to each other, and connecting ground conductors of said first and second transmission lines to each other.
Dependencies are inferred from the claim text.