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US 2003/0164223 A1Published application
Conducive, silicone-based compositions with improved initial adhesion reduced microvoiding
AssigneeHenkel Corporation
InventorsRobert P. Cross, Lester D. Bennington
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Abstract
The present invention relates generally to conductive, silicone-based compositions, with improved initial adhesion and reduced micro-voiding. More specifically, the present invention relates to a conductive, silicone-based composition, which includes a polyorganosiloxane, a silicone resin, and a conductive filler component.
Claims19
A curable conductive composition comprising:
- (a) a reactive polyorganosiloxane component;
- (b) a silicone resin formed as a hydrolysis and condensation product of at least one silane within the formula R1mR2pSi(X)4−(m+p), wherein R1 and R2may be the same or different and may be selected from the group consisting of monovalent ethylenically unsaturated radicals, C1-12 alkoxy, C6-12 aryloxy, (meth)acrylate, hydrogen, C1-12 alkyl, C6-12 aryl, C7-18 arylalkyl, and C7-18 alkylaryl, X is a hydrolyzable functionality, m is an integer from 1 to 3, and m+p is an integer from 1 to 3 provided at least one of R1 and R2 is a member selected from the group consisting of monovalent ethylenically unsaturated radicals, C1-12 alkoxy, C6-12 aryloxy, (meth)acrylate hydrogen;
- and
- (c) a conductive filler component.
1 more element
Dependencies are inferred from the claim text.