Foil-form soldering metal and method for processing the same
AssigneeTanaka Kikinzoku Kogyo K.K.
InventorKen-ichi Miyazaki
Life of this patent
Estimating the term…
Abstract
The present invention provides a processing method capable of continuously working an Au—Sn soldering metal having a foil form in room temperature. The foil-form soldering metal containing from 10% by weight to 90% by weight of Au and balance comprising Sn is subjected to heat treatment for five minutes to ten hours at 200° C. to 270° C., and subsequently the foil-form soldering metal is slit. Thus, the heat treatment of the Au—Sn soldering metal before slitting enables continuous slitting of the Au—Sn foil-form soldering metal in room temperature and facilitates the production of a ribbon-form soldering metal.
Claims4
A method for processing a foil-form soldering metal containing from 10% by weight to 90% by weight of Au and balance comprising Sn, comprising:
- subjecting the foil-form soldering metal to heat treatment for five minutes to ten hours at 200° C. to 270° C.;
- and subsequently processing the foil-form soldering metal.
Dependencies are inferred from the claim text.