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US 2003/0164204 A1Published application
Solder paste for fabricating bump
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsHo-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Ching-Fu Horng, Shih-Kuang Chen, Shyh-Ing Wu, Chun-Hung Lin, Yung-Chi Lee, Yu-Chen Chou, Tsung-Hua Wu, Su Tao
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Abstract
A solder paste for fabricating bumps includes a flux and metallic alloy powder. The metallic alloy powder includes a plurality of low eutectic metallic alloy granules, and the size of these metallic alloy granules is 20-60 μm and the average size of the metallic granules is 35 μm to 45 μm.
Claims10
A solder paste for fabricating bumps comprising
- a flux, and
- metallic alloy powder including a plurality of metallic alloy granules, wherein a size of the metallic alloy granules ranges from about 20 μm to about 60 μm.
A solder paste for fabricating bumps comprising
- a flux, and
- metallic alloy powder including a plurality of Sn/Pb alloy granules, wherein a ratio of lead to the Sn/Pb alloy ranges from about 85% to about 95% and a size of the metallic alloy granules ranges from about 20 μm to about 60 μm.
Dependencies are inferred from the claim text.