Low molecular weight polyurethane resins
AssigneeSun Chemical Corporation
InventorRobert Auerbach
Life of this patent
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Abstract
Disclosed is a polyurethane resin having a number average molecular weight of up to 5,000 which is prepared by reacting a diisocyanate compound with at least one monomer diol compound and optionally a polymer diol compound without a chain extendor to form a polymer, wherein the molar ratio of the monomer diol compound over the polymer diol compound when present is above 1 followed by capping the polymer with a terminator.
Claims32
In a polyurethane resin having a number average molecular weight of up to 5,000, the improvement wherein said resin is prepared by:
- (a) reacting a diisocyanate compound with at least one monomer diol compound and optionally a polymer diol compound without a chain extendor to form a polymer, wherein the molar ratio of the monomer diol compound over the polymer diol compound when present is above 1;
- and
- (b) capping the polymer with a terminator.
The resin of claim 13, wherein the organic solvent is an aprotic compound having a boiling temperature of about 60 to 140° C.
A method of preparing a polyurethane resin comprising:
- (a) reacting a diisocyanate compound with at least one monomer diol compound and optionally a polymer diol compound without a chain extendor to form a polymer, wherein the molar ratio of the monomer diol compound over the polymer diol compound when present is above 1;
- and
- (b) capping the polymer with a terminator.
Dependencies are inferred from the claim text.