Phenylethynyl-containing imide silanes
OwnerJoseph G. Smith JR., John W. Connell +3inventors
InventorsJoseph G. Smith JR., John W. Connell, Paul M. Hergenrother, Sharon E. Lowther, Cheol Park
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OwnerJoseph G. Smith JR., John W. Connell +3inventors
InventorsJoseph G. Smith JR., John W. Connell, Paul M. Hergenrother, Sharon E. Lowther, Cheol Park
Estimating the term…
Phenylethynyl containing imide-silanes were prepared from aminoalkyl and aminoaryl alkoxy silanes and 4-phenyletbynylphthalic anhydride in toluene to form the imide in one step or in N-methyl-2-pyrrolidinone (NMP) to form the amide acid intermediate. Controlled molecular weight pendent phenylethynyl amide acid oligomers terminated with aminoaryl alkoxy silanes were prepared in NMP from aromatic dianhydrides, aromatic diamines, diamines containing pendent phenylethynyl groups and aminoaryl alkoxy silanes. The phenylethynyl containing imide-silanes and controlled molecular weight pendent phenylethynyl amide acid oligomers terminated with aminoaryl alkoxy silanes were used to improve the adhesion between phenylethynyl containing imide adhesives and inorganic substrates (i.e. metal). Hydrolysis of the alkoxy silane moiety formed a silanol functionality which reacted with the metal surface to form a metal-oxygen-silicon (oxane) bond under the appropriate reaction conditions. Upon thermal cure, the phenylethynyl group of the coupling agent reacts with the phenylethynyl functionality of phenylethynyl containing imide adhesives and becomes chemically bonded to the matrix. The resultant adhesive bond is more durable (i.e. hot-wet environmental resistance) than adhesive bonds made without the use of the coupling agent due to covalent bond formation between the phenylethynyl containing imide-silane coupling agent or the controlled molecular weight pendent phenylethynyl amide acid oligomers terminated with aminoaryl alkoxy silanes and both the metal substrate and phenylethynyl containing imide adhesives.
A compound comprising the following chemical structure:
A compound comprising the following general chemical structure:
A method for treating an inorganic substrate, comprising the step of applying a compound to the substrate to form a treated substrate, said compound comprising the following chemical formula:
A compound comprising the following general structure:
A method for treating an inorganic substrate, comprising the step of applying a compound to a substrate, thereby forming a treated substrate, said compound comprising the following general formula:
A method for forming imide silanes containing at least one phenylethynyl moiety, comprising the steps of:
Dependencies are inferred from the claim text.