Heat resistant resin composition and adhesive film
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsNobuhiro Ichiroku, Toshio Shiobara
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Abstract
A resin composition comprising the associated product of a polyimide resin having acid anhydride groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin, and optionally, an epoxy resin-curing agent has excellent adhesion, heat resistance, shelf stability and solvent resistance. An adhesive film comprising the resin composition is useful as an adhesive or sealant for printed circuit boards and semiconductor packages.
Claims5
A heat resistant resin composition comprising the associated product of a polyimide resin having acid anhydride groups in the skeleton with a curing catalyst for epoxy resin.
Dependencies are inferred from the claim text.