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US 2003/0158308 A1Published application
Polymide molding compositions containing prepolymeric polyamides, a method for the preparation thereof and the use thereof
AssigneeEms-Chemie AG
InventorsRenato Nay, Manfred Hewel
Life of this patent
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Abstract
The invention concerns polyamide molding compositions with good surface quality and good flow behavior containing prepolymeric polyamides with a solution viscosity of μrel 1.01-1.30 in quantities from 0.1 to 20 wt. %.
Claims12
Polyamide molding compositions without impact strength modifier, with good surface quality and good flow behavior, comprising prepolymeric polyamides with a solution viscosity of μrel 1.01-1.30 (measured in 0.5% m-cresol) in quantities from 2-16 wt. % and 1-95 wt. % fillers.
Dependencies are inferred from the claim text.