Vacuum suction membrane for holding silicon wafer
AssigneeUnited Microelectronics Corp.
InventorsTzu-Shin Chen, Ming-Hsing Kao, Wen-Chin Lin, Hua-Bin Chi
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Abstract
A membrane for vacuum suction of a silicon water typically used inside a polishing head. The membrane has a flat main body and a plurality of protrusions each having a particle-like profile over the surface of the flat main body. The protrusions are formed in positions that correspond to the holes of a supporting multiple-hole panel. The protrusions on the flat main body lower the suction pressure between the wafer and the membrane somewhat so that wafer unloading failure is minimized.
Claims20
A membrane for vacuum suction of a silicon wafer, wherein the membrane is particularly suitable for wrapping a panel having a plurality of holes thereon inside a polishing head, comprising:
- a flat main body;
- and
- a plurality of protrusions distributed on the surface of the flat main body of the membrane, wherein the protrusions on the membrane are placed in positions that correspond to the holes on the multiple-hole panel.
A wafer suction device coupled to an external vacuum-driving system, comprising:
- a multiple-hole panel having a bottom section and a plurality of holes therein;
- and
- a membrane wrapping around the bottom section of the multiple-hole panel, the membrane comprising:
- a flat main body;
- and
- a plurality of protrusions distributed on the surface of the flat main body of the membrane, wherein the protrusions on the membrane are placed in positions that correspond to the holes on the multiple-hole panel.
A vacuum suction polishing head having a gripping pan, the inside of the gripping pan comprising:
- a multiple-hole panel;
- and
- a membrane at the bottom section of the multiple-hole panel, wherein the surface of the membrane has a plurality of protrusions.
Dependencies are inferred from the claim text.