Method of manufacturing plasma display device
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorHiroyuki Furukawa
Life of this patent
Estimating the term…
Abstract
Provided is a method of manufacturing a plasma display device. The device comprises a plasma display panel that has a plurality of terminals formed on each of at least two sides thereof, and a plurality of circuit boards to be connected to the terminals. In application of adhesive to the front faces and back faces of the circuit boards, the adhesive is applied to one of the sides having the circuit boards disposed at smaller intervals, and then to one of the sides having the circuit boards disposed at larger intervals. Alternatively, the adhesive is applied to a long side of the plasma display panel, and then to a short side thereof.
Claims12
A method of manufacturing a plasma display device, the device comprising:
- a panel having a plurality of sides, each of at least two sides of the plurality of sides having a plurality of terminals formed thereon;
- and
- a plurality of circuit boards to be connected to the plurality of terminals;
- wherein, in application of adhesive to front faces and back faces of the circuit boards, the adhesive is applied to one of the sides having the circuit boards disposed at a smaller interval, and then to one of the sides having the circuit boards disposed at a larger interval.
A method of manufacturing a plasma display device, the device comprising:
- a panel having opposed first and second substrates, each substrate having a plurality of terminals formed thereon;
- a plurality of first circuit boards to be connected to the terminals on the first substrate;
- and
- a plurality of second circuit boards to be connected to the terminals on the second substrate, an interval between the second circuit boards being smaller than an interval between the first circuit boards;
- said method including:
- a first adhesive-applying step of applying adhesive to back faces of the second circuit boards and then to front faces of the first circuit boards;
- and
- a second adhesive-applying step of applying adhesive to front faces of the second circuit boards and then to back faces of the first circuit boards.
A method of manufacturing a plasma display device, the device comprising:
- a panel having a plurality of sides, each of at least two sides of the plurality of sides having a plurality of terminals formed thereon;
- and
- a plurality of circuit boards to be connected to the plurality of terminals;
- wherein, in application of adhesive to front faces and back faces of the circuit boards, the adhesive is applied to one of the sides having the circuit boards disposed at a smaller interval first, and then applied so that a circuit is made of a periphery of the panel.
A method of manufacturing a plasma display device, the device comprising:
- a panel having opposed first and second substrates, each substrate having a plurality of terminals formed thereon;
- a plurality of first circuit boards to be connected to the terminals on the first substrate;
- and
- a plurality of second circuit boards to be connected to the terminals on the second substrate, an interval between the second circuit boards being smaller than an interval between the first circuit boards;
- said method including:
- a first adhesive-applying step of applying adhesive to back faces of the second circuit boards first and then to front faces of the first circuit boards so as to make a circuit of a periphery of the panel;
- and
- a second adhesive-applying step of applying adhesive to front faces of the second circuit boards first and then to back faces of the first circuit boards so as to make a circuit of a periphery of the panel.
A method of manufacturing a plasma display device, the device comprising:
- a panel having long sides and short sides, at least one of the long sides and at least one of the short sides having a plurality of terminals;
- and
- a plurality of circuit boards to be connected to the terminals;
- wherein, in application of adhesive to front faces and back faces of the circuit boards, the adhesive is applied to one of the long sides of the panel first and then to one of the short side thereof.
A method of manufacturing a plasma display device, the device comprising:
- a panel having opposed first and second substrates each having long sides and short sides, at least one of the short sides of the first substrate and at least one of the long sides of the second substrate having a plurality of terminals formed thereon;
- a plurality of first circuit boards to be connected to the terminals on the first substrate;
- and
- a plurality of second circuit boards to be connected to the terminals on the second substrate;
- said method including:
- a first adhesive-applying step of applying adhesive to back faces of the second circuit boards and then to front faces of the first circuit boards;
- and
- a second adhesive-applying step of applying adhesive to front faces of the second circuit boards and then to back faces of the first circuit boards.
A method of manufacturing a plasma display device, the device comprising:
- a panel having long sides and short sides, at least one of the long sides and at least one of the short sides having a plurality of terminals;
- and
- a plurality of circuit boards to be connected to the terminals;
- wherein, in application of adhesive to front faces and back faces of the circuit boards, the adhesive is applied to one of the long sides of the panel first, and then applied so that a circuit is made of a periphery of the panel.
A method of manufacturing a plasma display device, the device comprising:
- a panel having opposed first and second substrates each having long sides and short sides, at least one of the short sides of the first substrate and at least one of the long sides of the second substrate having a plurality of terminals formed thereon;
- a plurality of first circuit boards to be connected to the terminals on the first substrate;
- and
- a plurality of second circuit boards to be connected to the terminals on the second substrate;
- said method including:
- a first adhesive-applying step of applying adhesive to back faces of the second circuit boards first and then to front faces of the first circuit boards so as to make a circuit of a periphery of the panel;
- and
- a second adhesive-applying step of applying adhesive to front faces of the second circuit boards first and then to back faces of the first circuit boards so as to make a circuit of a periphery of the panel.
Dependencies are inferred from the claim text.