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AssigneeOji Paper Co., Ltd.
InventorsHiroyoshi Ueno, Yoshihisa Koto, Isao Ichioka, Takekazu Adachi, Mamoru Murata, Hirokazu Hiraoka, Manabu Ochida, Masayuki Noda
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The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.
A base material for a laminate comprising a plurality of non-woven fabric sheets which are heated under pressure so that they are integrated, said non-woven fabric sheet comprising (1) a non-woven fabric constituted of para-aramid fibers and prepared by wet type paper-making process and (2) a thermosetting resin binder incorporated into said non-woven fabric, said non-woven fabric sheet composed of 95 to 70 mass % of said para-aramid fibers and 5 to 30 mass % of said thermosetting resin binder based on the total mass of said para-aramid fibers and said thermosetting resin binder.
A base material for a laminate comprising a plurality of non-woven fabric sheets which are heated under pressure so that they are integrated, said non-woven fabric sheet comprising (1) a non-woven fabric constituted of para-aramid fibers and prepared by wet type paper making process and (2) a thermosetting resin binder incorporated into said non-woven fabric, said non-woven fabric sheet being dried by heat and a plurality of said non-woven fabric sheets being heated under pressure at a temperature of 30° or higher than said drying temperature and up to 400° C.
A process for producing a base material for a laminate comprising the steps of:
Dependencies are inferred from the claim text.