Digital signal cross-connect module having tin-plated copper plates

A digital signal cross-connect module, comprising:

• a housing;
• an output jack system formed on a first portion of the front aspect of said housing, the output jack system further comprising an output jack, a cross-connect output jack and an output monitoring jack for monitoring signals output from the output jack and the cross-connect output jack;
• an input jack system formed on a second portion of said front aspect of said housing, the input jack system further comprising an input jack, a cross-connect input jack and an input monitoring jack for monitoring signals input into the input jack and the cross-connect input jack;
• a BNC input connector and a BNC output connector formed on a first portion of a rear aspect of said housing;
• a BNC cross-connect input connector and a BNC cross-connect output connector formed on a second portion of said rear aspect of said housing, the BNC cross-connect input connector and the BNC cross-connect output connector arranged in parallel and in a staggered relationship with said BNC input connector and said BNC output connector;
• a first shielding cable electrically connecting said output jack and said BNC output jack;
• a second shielding cable electrically connecting said cross-connect output jack and said BNC cross-connect output connector;
• a third shielding cable electrically connecting said input jack and said BNC input jack;
• a fourth shielding cable electrically connecting said cross-connect input jack and said BNC cross-connect input connector;
• and
• a cross-talk prevention means for grounding said first, said second, said third and said fourth shielding cables to said housing.