Semiconductor device and method of manufacturing the same
AssigneeNEC Electronics Corporation
InventorHirokazu Honda
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Abstract
The present invention relates to a method of manufacturing a semiconductor device. In the method, an etching-back layer consisting of aluminum or copper is formed on a base substrate and a multilayer wiring board is manufactured on the etching-back layer. After that the etching-back layer is etched to be removed under the condition that the multilayer wiring board and the base substrate are not etched, so that the base substrate is separated from the multilayer wiring board. Accordingly, the base substrate can be reused.
Claims39
A method of manufacturing a semiconductor device comprising the steps of:
- forming an etching-back layer formed of a second material on a supporting substrate formed of a first material, said second material being different in etching rate from said first material;
- forming a multilayer wiring board on said etching-back layer;
- etching said etching-back layer to separate said supporting substrate from said multilayer wiring board;
- and
- mounting a semiconductor chip on said multilayer wiring board.
A method of manufacturing a semiconductor device comprising the steps of:
- forming an etching-back layer formed of a second material on a supporting substrate formed of a first material, said second material being different in etching rate from said first material;
- forming a multilayer wiring board on said etching-back layer;
- etching said etching-back layer to separate said supporting substrate from said multilayer wiring board;
- mounting a plurality of semiconductor chips on said multilayer wiring board;
- and
- separating said multilayer wiring board every said semiconductor chip.
A semiconductor device comprising:
- a multilayer wiring board;
- and
- a semiconductor chip mounted on said multilayer wiring board, said semiconductor chip being mounted on said multilayer wiring board which is separated from a supporting substrate by etching an etching-back layer which is formed between said multilayer wiring board and said supporting substrate.
Dependencies are inferred from the claim text.