Composition for the chemical mechanical polishing of metal and metal/dielectric structures
OwnerLothar Puppe, Gerd Passing +1inventors
InventorsLothar Puppe, Gerd Passing, Ming-Shih Tsai
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Abstract
A composition containing −2.5 to 70% by volume of a 30% by weight cationically modified silica sol, the cationically modified SiO2 particles of which have a mean particle size of 12 to 300 nm, and 0.5 to 22% by weight of at least one oxidizing agent, with pH of 2.5 to 6, is eminently suitable as a polishing slurry for the chemical mechanical polishing of metal and metal/dielectric structures.
Claims12
Composition containing 2.5 to 70% by volume of a 30% by weight cationically modified silica sol, the cationically modified SiO2 particles of which have a mean particle size of 12 to 300 nm, and 0.05 to 22% by weight of at least one oxidizing agent, with a pH of from 2.5 to 6.
Dependencies are inferred from the claim text.