Process and apparatus to subdivide objects
AssigneeFraunhofer-Gesellschaft zur Förderung derangewandten Forschung e.V.
InventorsDaniel Kray, Gerhard Willeke
Life of this patent
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Abstract
A process and an apparatus used to subdivide objects (4) into slices, in particular to manufacture wafers from semi-conducting monocrystalline blocks, wherein these blocks are subdivided into slices with the help of at least one cutting tool (3), and under the influence of an etchant. Prior to completely cutting and subdividing the object (4) (ingot) into individual slices (wafers), a separating foil (12) is introduced into each cut slit (9) to separate the slices. This efficiently prevents the resultant wafers from sticking together. The individual separation of the wafers is thus accomplished right when the cutting process takes place so that the necessary number of process steps to manufacture silicon wafers is reduced.
Claims14
A process to subdivide objects (4) for production of wafers from semi-conducting, monocrystalline blocks, comprising subdividing the blocks into slices with at least one cutting tool (3) and an etchant, and introducing a separating foil (12) into each slit cut (9) to separate the slices prior to complete cutting and subdivision of the object (4) into the individual slices.
An apparatus to subdivide objects (4) into slices, to manufacture wafers from semi-conducting monocrystalline blocks, comprising a cutter (1) having at least one cutting tool (3) and an etchant feed device, and one or more separating foils (12) provided to separate adjacent slices, the foils being introduced into each slit cut (9) between adjacent slices in the object (4) to be subdivided.
Dependencies are inferred from the claim text.