Electronic component, manufacturing method therefor, aggregate electronic component, mounting structure of electronic component, and electronic device

An electronic component, comprising:

• an electronic component body having first and second main surfaces opposed to each other, and side surfaces connecting said first and second main surfaces;
• wherein
• at least one of said first and second main surfaces is a mounting surface on which a surface mounted device is mounted;
• in said side surfaces, a plurality of grooves are arranged to have a first length and to extend from said first main surface to said second surface;
• and
• in each of said grooves, an external terminal electrode which has a second length smaller than said first length is arranged to extend in the longitudinal direction thereof.

An aggregate electronic component which has first and second main surfaces opposed to each other, and which is arranged so that a plurality of electronic components can be removed therefrom by dividing said aggregate electronic component in a direction that is substantially perpendicular to said main surfaces along predetermined dividing lines, said aggregate electronic component comprising:

• via-hole conductors each of which has an axial direction dimension that is less than the thickness between said first and second main surfaces, and each of which is arranged to straddle said dividing line;
• through-holes which pass through said first and second main surfaces, and each of which is arranged to divide said via-hole conductors;
• and
• external terminal electrodes each defined by a divided portion of said via-hole conductor that is divided by said through-hole.