Semiconductor build-up package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsKun-Ching Chen, Yi-Chuan Ding, In-De Ou
Life of this patent
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Abstract
A semiconductor build-up package includes a die, a circuit board and at least a dielectric layer. The circuit board has a surface for building up the dielectric layer, and the surface has a cavity for accommodating the die. The inside of multi-layer circuit board has conductive traces for expanding the electrical function of semiconductor build-up package. Each dielectric layer has conductive columns so that the die may electrically connect with the outermost dielectric layer. At least a conductive column is bonded on the surface of the multi-layer circuit board for inner electrical connection.
Claims20
A semiconductor build-up package comprising:
- a die having an active surface with a plurality of contacts and an inactive surface;
- a circuit board having a first surface, a second surface and a plurality of conductive traces, wherein the first surface has a cavity for accommodating the die;
- and
- a first dielectric layer formed on the active surface of the die and the first surface of the circuit board, having a plurality of conductive columns, wherein at least a conductive column is electrically coupled to the conductive traces of the circuit board.
A semiconductor multi-chip package comprising:
- at least a first die having an active surface, an inactive surface and a plurality of contacts on the active surface;
- a circuit board having a first surface and a second surface, a cavity formed on the first surface for accommodating the first die, wherein there are a plurality of conductive traces inside the circuit board;
- a first dielectric layer formed on the active surface of the first die and the first surface of the circuit board, the first dielectric layer having a plurality of conductive columns, wherein at least a conductive column electrically connects with the conductive traces of the circuit board;
- and
- at least a second die mounted on the second surface of the circuit board, the second die having a plurality of contacts which are electrically coupled to the conductive traces of the circuit board.
Dependencies are inferred from the claim text.