Semiconductor module substrate sheet, semiconductor module substrate sheet fabricating method and semiconductor module
AssigneeNissha Printing Co., Ltd.
InventorsKunitoshi Yamamoto, Koichiro Tsuji
Life of this patent
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Abstract
Through holes are formed at four peripheral edges of a plurality of semiconductor chip placement regions of an insulating substrate, except for coupling portions partially arranged thereat. A substrate sheet for semiconductor module is used in which connecting portions between inner lead portions and outer lead portions arranged on both surfaces of the substrate are formed in pattern on the side wall surface of the through hole. The semiconductor chip is mounted on each region, electrode terminals thereof and the inner lead portions are electrically connected to each other, the chip is sealed, and then the coupling portions are cut.
Claims31
A semiconductor module substrate sheet comprising:
- an insulating substrate having a semiconductor chip placement region on which a semiconductor chip can be placed;
- a plurality of inner lead sections that are formed on a surface identical to that of the semiconductor chip placement region of the insulating substrate and respectively electrically connected to a plurality of electrode terminals of the semiconductor chip placed on the semiconductor chip placement region so as to form a semiconductor module;
- a plurality of outer lead sections formed on a surface opposite to that of the semiconductor chip placement region of the insulating substrate;
- and
- a plurality of connecting sections that respectively connect the plurality of inner lead sections with the plurality of outer lead sections on a side wall surface constructed of one plane of the insulating substrate.
A semiconductor substrate sheet in which an insulating substrate is provided with through holes, connecting sections are provided on side wall surface oppositely from a semiconductor chip placement region, inner lead sections are extended in a direction away from the connecting sections, and outer lead sections are extended from the connecting sections in a direction away from a region corresponding to a rear surface of the semiconductor chip placement region, wherein a metal conductor section is formed in the semiconductor chip placement region.
A semiconductor substrate sheet in which an insulating substrate is provided with through holes, connecting sections are provided on side wall surface oppositely from a semiconductor chip placement region, inner lead sections are extended in a direction away from the connecting sections, and outer lead sections are extended from the connecting sections in a direction away from a region corresponding to a rear surface of the semiconductor chip placement region, wherein other connecting sections are provided so as not to come in contact with the connecting sections on the side wall surface located on the semiconductor chip placement region side of the through holes, a metal conductor section is provided for the semiconductor chip placement region, a metal layer section is provided for a region corresponding to the rear surface of the semiconductor chip placement region, and the metal conductor section and the metal layer section are connected together by way of said other connecting sections.
Dependencies are inferred from the claim text.