Pattern inspecting apparatus and pattern inspecting method

A pattern inspecting apparatus comprising:

• an image obtaining means for obtaining an image of a pattern formed on a substrate which is mounted on a support platform;
• a position correction means for recording a basic pattern beforehand, the basic pattern being used for correction of a mounted position when the substrate is mounted on the support platform, and said position correction means correcting a deviation of the mounted position using the basic pattern;
• a defect detecting means for detecting a defect of the pattern judging from the image obtained by said image obtaining means;
• a defect size judging means for judging a size of the defect detected by said defect detecting means;
• and
• a defect image recording portion for selecting only a pattern image, the defect of which has a size within a given range, from among the patterns where the defect has been detected, and recording the selected image.

A pattern inspecting method for inspecting a defect of a pattern formed on a substrate, said pattern inspecting method comprising:

• a program selecting step for selecting an inspection program that is set beforehand;
• a substrate mounting step for selecting a substrate to be inspected according to the inspection program to mount the selected substrate at a given position;
• a position correcting step for correcting a deviation of a mounted position of the substrate using a basic pattern formed on the substrate;
• and
• a defect detecting step for detecting a defect of the pattern,
• wherein, when said position correcting step is performed, if a mounted position cannot be corrected using the basic pattern, a position correcting step comprises a first temporary recording step for recording a new pattern temporarily, and a first temporary position correcting step for correcting a deviation of the mounted position of the substrate using the new pattern recorded at said first temporary recording step.