Fingerprint sensor apparatus and manufacturing method thereof
AssigneeFujitsu Limited
InventorsAkira Okada, Hideharu Sakoda, Michio Hayakawa, Fumihiko Taniguchi
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Abstract
A fingerprint sensor apparatus can provide a normal fingerprint sensor function even when a mold flash is formed. The fingerprint sensor apparatus recognizes a pattern of a fingerprint by being contacted by a finger. A semiconductor chip has a surface on which a sensor part is formed. The semiconductor chip is encapsulated by a seal resin. The sensor part is exposed in a bottom of an opening formed in the seal resin part. A distance between an edge of the bottom of the opening and an edge of the sensor part is 0.3 mm to 0.1 mm.
Claims10
A fingerprint sensor apparatus for recognizing a pattern of a fingerprint by being contacted by a finger, comprising:
- a semiconductor chip having a surface on which a sensor part is formed;
- and
- a seal resin part which encapsulates the semiconductor chip,
- wherein said sensor part is exposed in a bottom of an opening formed in the seal resin part, and a distance between an edge of the bottom of the opening and an edge of said sensor part is 0.3 mm to 0.1 mm.
A fingerprint sensor apparatus for recognizing a pattern of a fingerprint by being contacted by a finger, comprising:
- a semiconductor chip having a surface on which a sensor part is formed;
- and
- a seal resin part which encapsulates the semiconductor chip,
- wherein said sensor part is exposed in a bottom of an opening formed in the seal resin part;
- the bottom of the opening has a step formed by a first surface and a second surface which is higher than the first surface, said sensor part being exposed on said first surface;
- and a distance between said first surface and said second surface in a direction perpendicular to a surface of the sensor part is 70 μm to 150 μm.
A fingerprint sensor apparatus for recognizing a pattern of a fingerprint by being contacted by a finger, comprising:
- a semiconductor chip having a surface on which a sensor part is formed;
- and
- a seal resin part which encapsulates the semiconductor chip,
- wherein said sensor part and a part of a surface of the semiconductor chip are exposed in a bottom of an opening formed in the seal resin part, and a portion of said seal resin part forming said opening in a direction in which the finger is moved is a flat surface within the same plane in which an exposed surface of said semiconductor chip lies.
A fingerprint sensor apparatus for recognizing a pattern of a fingerprint by being contacted by a finger, comprising:
- a semiconductor chip having a surface on which a sensor part is formed;
- and
- a seal resin part which encapsulates the semiconductor chip,
- wherein said sensor part and a part of a surface of the semiconductor chip are exposed in a bottom of an opening formed in the seal resin part, and a portion of said seal resin part forming said opening in a direction in which the finger is moved is lower than other portions of the seal resin part but higher than an exposed surface of said semiconductor chip.
A manufacturing method of a fingerprint sensor apparatus for recognizing a pattern of a fingerprint by being contacted by a finger, comprising the steps of:
- attaching a spacer onto a predetermined position of a mold die for resin-molding a semiconductor chip having a surface on which a sensor part is formed, the spacer having a width greater than a width of said sensor part by a predetermined length;
- and
- placing said semiconductor chip inside the mold die, and resin-molding said semiconductor chip in a state where said spacer covers said sensor part of said semiconductor chip.
A manufacturing method of a fingerprint sensor apparatus for recognizing a pattern of a fingerprint by being contacted by a finger, comprising the steps of:
- applying a protective film having a predetermined thickness over a portion of a surface of a semiconductor chip and a sensor part formed on the surface of the semiconductor chip;
- placing said semiconductor chip inside said mold die, and resin-molding said semiconductor chip in a state where said protective tape covers the sensor part of said semiconductor chip;
- and
- removing said protective film from said semiconductor chip by pealing after the resin-molding so as to expose said sensor part and said portion of the surface of said semiconductor chip.
A manufacturing method of a fingerprint sensor apparatus for recognizing a pattern of a fingerprint by being contacted by a finger, comprising the steps of:
- forming a photosensitive resin film having a predetermined thickness over a portion of a surface of a semiconductor chip and a sensor part formed on the surface of the semiconductor chip;
- placing said semiconductor chip inside said mold die, and resin-molding said semiconductor chip in a state where said photosensitive resin film covers the sensor part of said semiconductor chip;
- and
- removing said protective film from said semiconductor chip by exposure after the resin-molding so as to expose said sensor part and said portion of the surface of said semiconductor chip.
Dependencies are inferred from the claim text.