Integrated temperature sensor
AssigneeSun Microsystems, Inc.
InventorsSpencer M. Gold, Claude R. Gauthier, Brian W. Amick, Kamran Zarrineh, Steven R. Boyle
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Abstract
An apparatus and method are provided for sensing a physical stimulus of an integrated circuit. The apparatus and method allow for accurate die temperature measurements of the integrated circuit and are able to provide a highly accurate die temperature measurement without the need for an independent voltage source or current source.
Claims31
A thermal sensor to sense a temperature comprising:
- an oscillator circuit to generate a first oscillating signal and a second oscillating signal;
- and
- one or more counter circuits to perform a first count on said first oscillating signal and a second count on said second oscillating signal, wherein said counter circuit halts said second count when said first count reaches a predetermined value and upon said first count reaching said predetermined value said counter circuit asserts a value of said second count to indicate a response of said thermal sensor.
In an integrated circuit having a thermal sensor, a method for said thermal sensor to sense a die temperature of said integrated circuit, said method comprising the steps of:
- generating a first oscillating signal and a second oscillating signal;
- performing a count on said first oscillating signal and said second oscillating signal;
- and
- asserting said count on said second oscillating signal when said count on said first oscillating signal reaches a desired value, wherein said count for said second oscillating signal indicates said die temperature of said integrated circuit as sensed by said thermal sensor.
A thermal sensor embedded in an integrated circuit that asserts a die temperature value, said thermal sensor comprising:
- a sensor circuit to generate an oscillating reference signal and a temperature dependent signal, wherein said oscillating reference signal is substantially temperature independent;
- and
- a converter circuit that converts said oscillating reference signal and said temperature dependent oscillating signal into said die temperature value.
Dependencies are inferred from the claim text.