Method for making a build-up package of a semiconductor die and structure formed from the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYi-Chuan Ding, In-De Ou, Kun-Ching Chen
Life of this patent
Estimating the term…
Abstract
A method for making a build-up package of a semiconductor die and a structure formed from the same. A copper foil with conductive columns is bonded to an encapsulated die by thermal compression, between thereof there is a pre-curing dielectric film sandwiched. The dielectric film is cured to form a dielectric layer of a die build-up package and the copper foil on the dielectric layer is etched to form the conductive traces. At least one conductive column in one of the dielectric layers is vertically corresponding to one of conductive column in the adjacent dielectric layer.
Claims15
A method for making a build-up package of a semiconductor die comprising the steps of:
- a) providing at least a die having an active surface with a plurality of bonding pads;
- b) forming an encapsulating material for carrying the die, the encapsulating material having a surface to expose the bonding pads of the die;
- c) thermally compressing a copper foil and a pre-curing dielectric film together to the surface of the encapsulating material, the copper foil having a plurality of conductive columns corresponding to the bonding pads of the die, the dielectric film sandwiched between the copper foil and the encapsulating material;
- d) curing the dielectric film;
- and
- e) etching the copper foil to form the conductive pads which electrically connect the conductive columns.
A build-up package of a semiconductor die comprising:
- a die having an active surface with a plurality of bonding pads;
- an encapsulating material for carrying the die, the encapsulating material having a surface uncovering the bonding pads of the die;
- a first dielectric layer formed on the surface of the encapsulating material, the first dielectric layer having a plurality of conductive columns which vertically extend through the first dielectric layer and mount onto the bonding pads of the die;
- a second dielectric layer formed on the first dielectric layer, the second dielectric layer having a plurality of conductive columns which vertically extend through the second dielectric layer and electrically connect with the conductive columns of the first dielectric layer;
- and
- a patterned circuit layer interposed between the first dielectric layer and the second dielectric layer;
- wherein at least one of the conductive columns of the second dielectric layer is vertical on the corresponding conductive column of the first dielectric layer.
A build-up package of a semiconductor die comprising:
- a die having an active surface with a plurality of bonding pads;
- an encapsulating material for carrying the die, the encapsulating material having a surface uncovering the bonding pads of the die;
- a plurality of dielectric layers stacked on the surface of the encapsulating material;
- a plurality of conductive columns formed in each dielectric layer, the conductive columns extending through the corresponding dielectric layer and electrically coupling to the bonding pads of the die, wherein at least one conductive column in one of the dielectric layers is vertically corresponding to one of conductive column in the adjacent dielectric layer;
- and
- a patterned circuit layer interposed between two adjacent dielectric layers.
Dependencies are inferred from the claim text.