Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management
OwnerJoseph Ted Dibene II, David H. Hartkeinventors
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Abstract
A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.
Claims62
A system for managing electrical power distribution and thermal dissipation, the system comprising:
- a circuit board having a first side and a second side, wherein the second side is substantially opposite the first side;
- a power conditioning circuit on the circuit board;
- a substrate having a first substrate side facing the second side of the circuit board and a second substrate side substantially opposite the first substrate side;
- a first processor mounted on the first substrate side and having a top surface;
- a second processor mounted on the first substrate side and having a top surface;
- a plurality of electrical conductors arranged on the second substrate side and electrically connected to the processor;
- and
- an interconnect device releasably connecting the power conditioning circuit to the substrate.
A system for managing electrical power distribution and thermal dissipation, the system comprising:
- a power supply mounted on a circuit board, the circuit board having a first side and a second side substantially opposite the first side;
- a substrate having a first side facing the second side of the circuit board and a second side substantially opposite the first side of the substrate;
- a first processor mounted on the first side of the substrate, the first processor having a top surface;
- a second processor mounted on the first side of the substrate, the second processor having a top surface;
- a plurality of electrical conductors positioned on the second side of the substrate configured to provide one or more signals to the first and second processors;
- an interconnect device connected to the second side of the circuit board and the first side of the substrate to provide power from the power supply to the first and second processors;
- and
- a heatsink connected to the first side of the circuit board and thermally coupled to the top surfaces of the first and second processors.
A system for managing electrical power distribution and thermal dissipation, the system comprising:
- a heatsink;
- a power conditioning circuit mounted on a circuit board having a first side thermally coupled to the heatsink and a second side substantially opposite the first side;
- a substrate having a first side facing the second side of the circuit board and a second side substantially opposite the first side of the substrate;
- a first electronic component mounted on the first side of the substrate, the first electronic component having a surface thermally coupled to the heatsink;
- a second electronic component mounted on the first side of the substrate, the second electronic component having a surface thermally coupled to the heatsink;
- and
- a motherboard having a first surface facing the second side of the substrate and electrically connected to the first electronic component and the second electronic component.
A method of managing electrical power distribution and thermal dissipation, the method comprising:
- mounting a circuit board including a power conditioning circuit and a heatsink to a substrate having a first processor and a second processor such that the heatsink overlaps at least a portion of one of the first processor and the second processor;
- electrically connecting the power conditioning circuit to the substrate;
- and
- thermally coupling the first processor and the second processor to the heatsink.
A method of managing electrical power distribution and thermal dissipation, the method comprising:
- mounting a power regulation module, which has a heatsink, above a surface of a first processor such that the heatsink is positioned over at least a portion of the first processor;
- electrically connecting the power regulation module to the first processor and a second processor;
- and
- thermally coupling the first processor and the second processor to the heatsink.
A system for managing electrical power distribution and thermal dissipation, the system comprising:
- a heatsink;
- a power conditioning circuit including a circuit board having a first side thermally coupled to the heatsink, a second side substantially opposite the first side, a first aperture, a second aperture, and a third aperture;
- an interposer board having a first side facing the second side of the circuit board, and a second side substantially opposite the first side;
- a first processor mounted on the first side of the interposer board and thermally connected to the heatsink through the first aperture;
- a second processor mounted on the first side of the interposer board and thermally connected to the heatsink through the second aperture;
- an Application Specific Integrated Circuit (ASIC) mounted on the first side of the interposer board and thermally connected to the heatsink through the third aperture;
- and
- a plurality of power connectors releasably connecting the power conditioning circuit to the interposer board and configured to electrically connect the power conditioning circuit to the first processor, the second processor, and the ASIC.
A system for managing electrical power distribution and thermal dissipation, the system comprising:
- a first processor mounted on a first substrate;
- a second processor mounted on a second substrate;
- a power conditioning circuit mounted in a different z-axis position from the first processor;
- wherein the z-axis is substantially perpendicular to a mounting surface of the first processor;
- a first power connector separably connecting the power conditioning circuit to the first processor;
- and
- a second power connector separably connecting the power conditioning circuit to the second processor.
Dependencies are inferred from the claim text.