System for reducing apparent height of a board system
AssigneeKyocera Wireless Corp.
InventorPaul Aurelio Martinez
Life of this patent
Estimating the term…
Abstract
A system for reducing an apparent height of a board system is provided. The board system may include, for example, a carrier, a component, a printed circuit board and/or a solder material. The component is mounted on a first side of the carrier. The printed circuit board has a hole that is structured to accommodate the component. The solder material solders the carrier to the printed circuit board and provides a structural bond between the carrier and the printed circuit board. At least one portion of the solder material provides an electrical coupling between the carrier and the printed circuit board and at least one portion of the component is maintained in the hole after the carrier is soldered to the printed circuit board.
Claims12
A system for reducing apparent height of a board system, comprising:
- a carrier;
- a component mounted on a first side of the carrier;
- a printed circuit board with a hole, the hole being structured to accommodate the component;
- and
- a solder material soldering the carrier to the printed circuit board and providing a structural bond between the carrier and the printed circuit board, at least one portion of the solder material providing an electrical coupling between the carrier and the printed circuit board,
- wherein at least one portion of the component is maintained in the hole after the carrier is soldered to the printed circuit board.
A wireless communications device, comprising:
- a duplexer;
- a carrier board having a first side on which is mounted the duplexer;
- a printed circuit board with a hole through which the duplexer fits;
- and
- a solder material soldering the carrier board to the printed circuit board and providing a structural bond between the carrier board and the printed circuit board, at least one portion of the solder material providing an electrical coupling between the carrier board and the printed circuit board,
- wherein the duplexer is coupled electrically to printed circuit board via the carrier board and the at least one portion of the solder material.
A computer system, comprising:
- a printed circuit board;
- a packaged integrated chip;
- a carrier having a first side on which the packaged integrated chip is mounted;
- a printed circuit board with a hole through which the packaged integrated chip fits;
- and
- a solder material soldering the carrier to the printed circuit board and providing a structural bond between the carrier and the printed circuit board, at least one portion of the solder material providing an electrical coupling between the carrier and the printed circuit board,
- wherein the packaged integrated chip is coupled electrically to printed circuit board via the carrier board and the at least one portion of the solder material.
A system for reducing apparent height of a board system, comprising:
- a printed circuit board with a recess on a first side of the printed circuit board, the hole being structured to accommodate the component;
- and
- a component mounted on the printed circuit board in the recess.
A system for reducing apparent height of a board system, comprising:
- a component having a first portion and a second portion, the second portion including a lateral protrusion;
- a printed circuit board with a hole, the hole being structured to accommodate the component;
- and
- a solder material soldering the component to the lateral protrusion and providing a structural bond between the component and the printed circuit board, at least one portion of the solder material providing an electrical coupling between the component and the printed circuit board,
- wherein at least part of the first portion of the component is maintained in the hole after the component is soldered to the printed circuit board.
Dependencies are inferred from the claim text.