US 2003/0156391 A1 · Wiring board and soldering method therefor

Abstract

A circuit board comprising a first solder leading land 13a disposed next to a mounting land located rearmost in a direction the circuit board moving during flow soldering of an electronic component, and a second solder leading land 13b disposed behind the first solder leading land 13a against the direction. The present invention provides a circuit board which can effectively prevent solder bridges caused by excessive solder accumulated around leads and lands located in the rearmost position while the electronic component is flow soldered at narrow pitches as is represented by a case with QFPIC. The circuit board of the present invention is suitable for use of lead-free solder, thus contributes to an environment protection.

Claims10

Dependent claims

A circuit board for surface mounting electronic component with narrow lead pitches using solder comprising:

a first solder leading land disposed on the circuit board in a vicinity of a land where the electronic component are mounted;
and
a second solder leading land disposed next to and at an opposite to the electronic component side of the fist solder leading land.

Dependencies are inferred from the claim text.

Facts

Application

10/311,993Filed 11 Feb 2003

Priority

JP 2001-13146627 Apr 2001

Published

21 Aug 2003

Term ends

Not estimatedThe source records don’t support an estimate.

Classification11 codes

H05K 3/3468
Application of solder: application of molten solder, e.g. dip soldering
H05K 1/111
Printed elements for providing electric connections to or between printed circuits: pads for surface mounting, e.g. lay-out
H05K 1/116
Via connections; Lands around holes or via connections: lands, clearance holes or other lay-out details concerning the surrounding of a via
H05K 3/3447
By soldering: lead-in-hole components

Wiring board and soldering method therefor

Life of this patent

Wiring board and soldering method therefor

Life of this patent

Abstract

Claims10