US 2003/0155845 A1Published application

Thin film piezoelectric element and its manufacturing method

AssigneeMatsushita Elec. Ind. Co. Ltd.

InventorsHirokazu Uchiyama, Yuko Ogawa, Hiroyuki Kita

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Abstract

A method of manufacturing a thin film piezoelectric element, wherein main electrode layer, piezoelectric thin film, and opposed electrode layer respectively having specified shapes are first formed on first substrate and second substrate, and after that, the opposed electrodes are opposed and bonded to each other, and insulating resin layer is formed over the peripheral portion thereof, and then the second substrate is removed, the insulating resin layer is etched, and connecting electrode pad is formed, and finally, the first substrate is removed to obtain a completely separated thin film piezoelectric element. By this method, it is possible to improve the reproducibility of shapes and to prevent trouble such as shorting between the electrodes which hold the piezoelectric thin film, thereby making it possible to provide a thin film piezoelectric element that may assure high yield without variation in piezoelectric characteristics, and its manufacturing method.

Claims11

Dependent claims

A manufacturing method for thin film piezoelectric elements, comprising the steps of:

forming a plurality of first thin film patterns on a first substrate, wherein a first piezoelectric thin film is held between a first main electrode layer and a first opposed electrode layer on said first substrate, and at least a part of said first main electrode layer disposed at said first substrate side is larger in shape than said first piezoelectric thin film and said first opposed electrode layer;
forming a plurality of second thin film patterns on a second substrate, wherein a second piezoelectric thin film is held between a second main electrode layer and a second opposed electrode layer on said second substrate, and said second piezoelectric thin film, said second main electrode layer, and said second opposed electrode layer are nearly same in shape as said first piezoelectric thin film;
forming a plurality of structures, integrated by bonding said first thin film pattern and said second thin film pattern opposed and positioned to each other so as to be placed one upon another, and an insulating resin layer for protecting said structures;
selectively removing only said second substrate in order to expose said plurality of structures protected by said insulating resin layer;
etching said insulating resin layer into a shape that covers a peripheral portion of said structure except a part of said first main electrode layer;
forming a connecting electrode pad for connecting said first main electrode layer, said first opposed electrode layer, said second main electrode layer, and said second opposed electrode layer to external equipment;
and
selectively removing only said first substrate.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 10/287,797Filed 5 Nov 2002
Priority: JP 2001-3391095 Nov 2001
Published: 21 Aug 2003
Term ends: Not estimatedThe source records don’t support an estimate.

Classification12 codes

H10N 30/082
Shaping or machining of piezoelectric or electrostrictive bodies: by etching, e.g. lithography
H10N 30/206
With electrical input and mechanical output, e.g. functioning as actuators or vibrators: using only longitudinal or thickness displacement, e.g.…
H10N 30/074
Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base: by depositing piezoelectric or…
Y10S 29/001
Metal working: method or apparatus involving adhesive