Back to results
US 2003/0155844 A1Published application
SAW device
AssigneeOki Electric Industry Co., Ltd.
InventorKenichi Anasako
Life of this patent
Estimating the term…
Abstract
A surface acoustic wave (SAW) device comprises a piezoelectric substrate, at least one alloy layer made of aluminum (Al) and copper (Cu), at least one oxide layer, and at least one metal layer made of a metal other than Al, wherein the alloy layer, oxide layer, and metal layers are laminated one upon another.
Claims21
A surface acoustic wave (SAW) device comprising:
- a piezoelectric substrate;
- at least one alloy layer made of aluminum (Al) and copper (Cu);
- at least one oxide layer;
- and
- at least one metal layer made of a metal other than Al, wherein said alloy layer, oxide layer, and metal layers are laminated one upon another.
2 more elements
A surface acoustic wave (SAW) device comprising:
- a piezoelectric substrate;
- at least one first metal layer made of a metal other than aluminum (Al) and copper (Cu);
- at least one second metal layer made of a metal other than Al, Cu, and said metal used in said first metal layer;
- and
- at least one alloy layer made of Al and Cu, wherein said first metal layer, second metal layer, and alloy layer are provided in this order from said piezoelectric substrate.
2 more elements
A surface acoustic wave (SAW) device comprising:
- a piezoelectric substrate;
- at least one first metal layer made of a metal other than aluminum (Al) and copper (Cu);
- at least one oxide layer;
- at least one second metal layer made of a metal other than Al, Cu, and said metal used in said first metal layer;
- and
- at least one alloy layer made of Al and Cu, wherein said first metal layer, oxide layer, second metal layer, and alloy layer are provided in this order from said piezoelectric substrate.
3 more elements
Dependencies are inferred from the claim text.