Liquid epoxy resin composition and semiconductor device
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsKazuaki Sumita, Haruyoshi Kuwabara, Toshio Shiobara
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Abstract
In a liquid epoxy resin composition comprising a liquid epoxy resin, a curing agent, a curing accelerator, and an inorganic filler, the liquid epoxy resin is a mixture of (a) a liquid epoxy resin containing two or less epoxy functional groups and (b) a solid epoxy resin containing two or more epoxy functional groups in a weight ratio (a)/(b) of from 9/1 to 1/4, having a viscosity of up to 10,000 poises at 25° C. as measured by an E type viscometer. The composition is adherent to silicon chips, the cured product is highly resistant to humidity and thermal shocks, and the composition is useful as sealant for semiconductor devices.
Claims9
A liquid epoxy resin composition comprising a liquid epoxy resin, a curing agent, a curing accelerator, and an inorganic filler as essential components,
- said liquid epoxy resin comprising a mixture of (a) an epoxy resin containing two or less epoxy functional groups in a molecule and being liquid at normal temperature and (b) an epoxy resin containing two or more epoxy functional groups in a molecule and being solid at normal temperature in a weight ratio of epoxy resin (a)/epoxy resin (b) of from 9/1 to 1/4,
- said solid epoxy resin (b) being selected from epoxy resins of the following general formulae (1) to (4) and combinations thereof:
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- wherein R is independently hydrogen, C1—C4 alkyl or phenyl, and x is 0 to 10,
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- wherein R1 is hydrogen or a monovalent hydrocarbon group of 1 to 6 carbon atoms, R′ is hydrogen, methyl or ethyl, and y is an integer of 0 to 6,
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- wherein z is an integer of at least 1,
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- wherein R1 to R4 are each independently hydrogen or a monovalent hydrocarbon group of 1 to 6 carbon atoms,
- said epoxy resin mixture having a viscosity of up to 10,000 poises at 25° C. as measured by an E type viscometer,
- the composition having a toughness K1c of at least 3.0.
Dependencies are inferred from the claim text.