Adhesives, adhesive films and electric devices
AssigneeSony Chemicals Corp.
InventorSatoshi Yamamoto
Life of this patent
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Abstract
FILMS AND ELECTRIC DEVICES An object of the present invention is to provide an adhesive with which voids are less likely to occur and adherends are not curved. Adhesives of the present invention have excellent dispensability from nozzles of dispensers because the overall specific gravity of the adhesives is adjusted to 1.4 or more and 4.0 or less by adding a filler having a specific gravity of 3.0 or more and 9.0 or less. A highly reliable electric device 1 can be obtained because no voids are generated in an adhesive 12 or an adherend or a flexible wiring board 5 is not curved when the flexible wiring board and a semiconductor chip 11 are connected.
Claims8
An adhesive comprising a binder based on a thermosetting resin, a hardener for the thermosetting resin and an insulating filler, wherein the filler has a specific gravity of 3.0 or more and 9.0 or less and the adhesive has an overall specific gravity of 1.4 or more and 4.0 or less.
An adhesive film obtained by forming a film of an adhesive comprising a binder based on a thermosetting resin, a hardener for the thermosetting resin and an insulating filler, wherein the filler has a specific gravity of 3.0 or more and 9.0 or less and the adhesive has an overall specific gravity of 1.4 or more and 4.0 or less.
An electric device comprising a semiconductor chip and a substrate with an adhesive being inserted between the semiconductor chip and the substrate and cured by heat treatment, wherein the adhesive comprises a binder based on a thermosetting resin, a hardener for the thermosetting resin and an insulating filler, wherein the filler has a specific gravity of 3.0 or more and 9.0 or less and the adhesive has a specific gravity before hardening of the adhesive, 1.4 or more and 4.0 or less.
Dependencies are inferred from the claim text.