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AssigneeInfineon Technologies AG
InventorsAlbert Auburger, Frank Klose, Rudolf Lehner, Horst Theuss
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A radio-frequency power component and a radio-frequency power module, as well as to methods for producing them are encompassed. The radio-frequency power component has a semiconductor chip that is suitable for flip chip mounting. The semiconductor chip has an active upper face that produces power losses. This active upper face is covered by an electrically isolating layer leaving free contact surfaces, with a heat-dissipating metal layer being applied to its upper face. The metal layer directly dissipates the heat losses from the active semiconductor structures.
A radio-frequency power component, comprising a semiconductor chip for flip chip mounting, said semiconductor chip having an active upper face producing power losses and a passive rear face, said upper face having. active semiconductor structures and an electrically isolating layer with an upper surface and covering said active semiconductor structures and leaving free contact surfaces with external contacts configured in a defined grid size, and a heat-dissipating metal layer disposed on said upper face of said isolating layer and being electrically isolated from said active semiconductor structures.
A method for producing radio-frequency power components, which comprises the steps:
A method for producing a radio-frequency power module, which comprises the steps:
Dependencies are inferred from the claim text.