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US 2003/0155660 A1Published application
Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
AssigneeSeiko Epson Corporation
InventorsTakuya Takahashi, Hiroyuki Tomimatsu
Life of this patent
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Abstract
A tip of a first wire is bonded to a first electrode. The first wire is drawn from the first electrode to a bump on a second electrode. A part of the first wire is deformed and bonded to the bump. A tip of a second wire formed in the shape of a ball is bonded to the bump by using a tool in a state in which at least a part of the tip is superposed on the first wire. A part of the first wire which is not deformed by bonding is prevented from being deformed by the tip of the second wire and the tool.
Claims32
A method of manufacturing a semiconductor device comprising steps of:
- (a) bonding a first tip of a first wire to a first electrode;
- (b) drawing the first wire from the first electrode to a bump on a second electrode;
- (c) bonding a part of the first wire to the bump by deforming the part of the first wire;
- and
- (d) bonding a second tip of a second wire formed in a shape of a ball to the bump by using a tool in a state in which at least a part of the second tip of the second wire is superposed on the first wire,
- wherein the bonding step is performed without causing a deformation to a part of the first wire that is not deformed by bonding by the second tip of the second wire and the tool in the step (d).
3 more elements
A semiconductor device manufactured by using a method comprising steps of:
- (a) bonding a first tip of a first wire to a first electrode;
- (b) drawing the first wire from the first electrode to a bump on a second electrode;
- (c) bonding apart of the first wire to the bump by deforming the part of the first wire;
- and
- (d) bonding a second tip of a second wire formed in a shape of a ball to the bump by using a tool in a state in which at least a part of the second tip of the second wire is superposed on the first wire,
- wherein the bonding step is performed without causing a deformation to a part of the first wire that is not deformed by bonding by the second tip of the second wire and the tool in the step (d).
3 more elements
A semiconductor device comprising:
- a lead having a part which becomes a first electrode;
- a semiconductor chip which includes an integrated circuit, a second electrode, and a bump formed on the second electrode;
- another semiconductor chip which includes an integrated circuit and a third electrode;
- a first wire having one end electrically connected with the first electrode, and another end electrically connected with the bump;
- and
- a second wire having one end electrically connected with the bump in a state in which at least a part of the first end is superposed on the first wire, and another end electrically connected with the third electrode,
- wherein the center of the first end of the second wire is disposed on a portion of the bump beyond the center of the bump in a drawing direction of the first wire.
4 more elements
A semiconductor device comprising:
- a first semiconductor chip which includes an integrated circuit and a first electrode;
- a second semiconductor chip which includes an integrated circuit, a second electrode, and a bump formed on the second electrode;
- a third semiconductor chip which includes an integrated circuit and a third electrode;
- a lead which is electrically connected with one of the first to third semiconductor chips;
- a first wire having one end electrically connected with the first electrode, and another end electrically connected with the bump;
- and
- a second wire having one end electrically connected with the bump in a state in which at least a part of the first end is superposed on the first wire, and another end electrically connected with the third electrode,
- wherein the center of the first end of the second wire is disposed on a portion of the bump beyond the center of the bump in a drawing direction of the first wire.
5 more elements
A circuit board having a semiconductor device mounted on the circuit board, the semiconductor device being manufactured by using a method comprising steps of:
- (a) bonding a first tip of a first wire to a first electrode;
- (b) drawing the first wire from the first electrode to a bump on a second electrode;
- (c) bonding a part of the first wire to the bump by deforming the part of the first wire;
- and
- (d) bonding a second tip of a second wire formed in a shape of a ball to the bump by using a tool in a state in which at least a part of the second tip of the second wire is superposed on the first wire,
- wherein the bonding step is performed without causing a deformation to a part of the first wire that is not deformed by bonding by the second tip of the second wire and the tool in the step (d).
3 more elements
A circuit board having a semiconductor device mounted on the circuit board, the semiconductor device comprising:
- a lead having a part which becomes a first electrode;
- a semiconductor chip which includes an integrated circuit, a second electrode, and a bump formed on the second electrode;
- another semiconductor chip which includes an integrated circuit and a third electrode;
- a first wire having one end electrically connected with the first electrode, and another end electrically connected with the bump;
- and
- a second wire having one end electrically connected with the bump in a state in which at least a part of the first end is superposed on the first wire, and another end electrically connected with the third electrode,
- wherein the center of the first end of the second wire is disposed on a portion of the bump beyond the center of the bump in a drawing direction of the first wire.
4 more elements
A circuit board having a semiconductor device mounted on the circuit board, the semiconductor device comprising:
- a first semiconductor chip which includes an integrated circuit and a first electrode;
- a second semiconductor chip which includes an integrated circuit, a second electrode, and a bump formed on the second electrode;
- a third semiconductor chip which includes an integrated circuit and a third electrode;
- a lead which is electrically connected with one of the first to third semiconductor chips;
- a first wire having one end electrically connected with the first electrode, and another end electrically connected with the bump;
- and
- a second wire having one end electrically connected with the bump in a state in which at least a part of the first end is superposed on the first wire, and another end electrically connected with the third electrode,
- wherein the center of the first end of the second wire is disposed on a portion of the bump beyond the center of the bump in a drawing direction of the first wire.
5 more elements
Electronic equipment having a semiconductor device manufactured by using a method comprising steps of:
- (a) bonding a first tip of a first wire to a first electrode;
- (b) drawing the first wire from the first electrode to a bump on a second electrode;
- (c) bonding a part of the first wire to the bump by deforming the part of the first wire;
- and
- (d) bonding a second tip of a second wire formed in a shape of a ball to the bump by using a tool in a state in which at least a part of the second tip of the second wire is superposed on the first wire,
- wherein the bonding step is performed without causing a deformation to a part of the first wire that is not deformed by bonding by the second tip of the second wire and the tool in the step (d).
3 more elements
Electronic equipment having a semiconductor device which comprises:
- a lead having a part which becomes a first electrode;
- a semiconductor chip which includes an integrated circuit, a second electrode, and a bump formed on the second electrode;
- another semiconductor chip which includes an integrated circuit and a third electrode;
- a first wire having one end electrically connected with the first electrode, and another end electrically connected with the bump;
- and
- a second wire having one end electrically connected with the bump in a state in which at least a part of the first end is superposed on the first wire, and another end electrically connected with the third electrode,
- wherein the center of the first end of the second wire is disposed on a portion of the bump beyond the center of the bump in a drawing direction of the first wire.
4 more elements
Electronic equipment having a semiconductor device which comprises:
- a first semiconductor chip which includes an integrated circuit and a first electrode;
- a second semiconductor chip which includes an integrated circuit, a second electrode, and a bump formed on the second electrode;
- a third semiconductor chip which includes an integrated circuit and a third electrode;
- a lead which is electrically connected with one of the first to third semiconductor chips;
- a first wire having one end electrically connected with the first electrode, and another end electrically connected with the bump;
- and
- a second wire having one end electrically connected with the bump in a state in which at least a part of the first end is superposed on the first wire, and another end electrically connected with the third electrode,
- wherein the center of the first end of the second wire is disposed on a portion of the bump beyond the center of the bump in a drawing direction of the first wire.
5 more elements
Dependencies are inferred from the claim text.