Memory module having interconnected and stacked integrated circuits

A memory module, comprising:

• a stacked pair of integrated circuits, wherein a first one of the pair of integrated circuits comprises storage elements and a second one of the pair of integrated circuits comprises a controller;
• a lead frame comprising a first portion and a second portion, wherein the first portion is configured below the stacked pair of integrated circuits and the second portion comprises a plurality of conductors coplanar with and extending laterally outside of the first portion;
• a first set of wires extending between the stacked integrated circuits and a first set of the plurality of conductors;
• and
• a second set of wires which transmit power and ground signals only extending between the stacked integrated circuits and the first portion.

A memory module, comprising:

• a multi-level array of storage cells;
• a controller electrically coupled to the storage cells;
• a substrate comprising a plurality of conductors;
• and
• means for connecting the controller and/or storage cells to the plurality of conductors which terminate along a linear axis near a single edge of the memory module.