Anisotropically conductive film
OwnerCindy Chia-Wen Chiu, David Hsein-Pin Chen +3inventors
InventorsCindy Chia-Wen Chiu, David Hsein-Pin Chen, Philip Yi Zhi Chu, Hsiao Ken Chuang, H. Paul Barker
Life of this patent
Estimating the term…
Abstract
An anisotropically conductive structure for providing electrical interconnection between electronic components, and the process for making such anisotropically conductive structure. The anisotropically conductive structure includes a dielectric matrix having a substantially uniform thickness; an array of vias extending into or through the matrix; a plurality of conductive elements, wherein individual via contains at least one conductive element; a first adhesive layer adhered to the first major surface of the matrix; and optionally, a second adhesive layer adhered to the second major surface of the matrix.
Claims59
An anisotropically conductive structure comprising:
- a dielectric matrix having a substantially uniform thickness and having a first major surface and a second major surface;
- an array of vias extending from the first major surface to the second major surface of the matrix, wherein the opening of the via at the first major surface is larger than the opening of the via at the second major surface;
- a plurality of conductive elements, wherein individual vias contain at least one conductive element;
- and
- a first adhesive layer adhered to the first major surface of the matrix.
An anisotropically conductive structure comprising:
- a dielectric matrix having a substantially uniform thickness and having a first major surface and a second major surface;
- an array of vias extending from the first major surface into the thickness of the matrix forming an array of microindentations of uniform depth in the matrix;
- a plurality of conductive elements, wherein individual vias contain at least one conductive element;
- and
- a first adhesive layer adhered to the first major surface of the matrix.
A method for making an anisotropically conductive structure comprising the steps of:
- providing a multilayer structure comprising a dielectric film having a first major surface and a second major surface, and a carrier layer having an inner surface and an outer surface, wherein the inner surface is releasably adhered to the second major surface of the dielectric film;
- forming an array of tapered vias extending from the first major surface of the dielectric film into the thickness of the dielectric film with an embossing device having an array of tapered projections projecting therefrom;
- filling individual tapered vias with at least one conductive element;
- and
- removing the carrier layer.
A method for making an anisotropically conductive structure comprising the steps of:
- providing a dielectric film having a first major surface and a second major surface;
- forming an array of tapered vias extending from the first major surface of the dielectric film into the thickness of the dielectric film with an embossing device having an array of tapered projections projecting therefrom;
- and
- filling individual the tapered vias with at least one conductive element.
Dependencies are inferred from the claim text.