Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate
AssigneeNorth Inc.
InventorsTomoo Iijima, Kimitaka Endo
Life of this patent
Estimating the term…
Abstract
A connecting member between wiring films is provided in which: a normal copper foil, which is a general-purpose component and not expensive, or the like can be used as a material; formation of bumps is sufficiently achieved by conducting etching one time; and a necessary number of layers can be laminated and pressed collectively at a time. Bumps, which are formed approximately in a cone-shape, for connecting wiring films of a multilayer wiring substrate are embedded in a second resin film that serves as an interlayer insulating film.
Claims16
A connecting member between wiring films, wherein a plurality of bumps, which are made of copper or copper alloy and are formed approximately in a cone-shape, for connecting wiring films of a multilayer wiring substrate are embedded in an insulating film such that at least one ends of the bumps are projected therefrom.
A method of manufacturing a connecting member between wiring films, comprising:
- laminating a carrier layer on a bump forming metal foil;
- forming resist patterns to an opposite surface of the bump forming metal foil to the surface on which the carrier layer is laminated;
- performing etching to the bump forming metal foil with the resist patterns serving as a mask to form a first member in which a plurality of bumps, which are formed approximately in a cone-shape, are projected from the carrier layer;
- laminating an insulating film on the first member so as to make top portions of the bumps be exposed from the insulating film to form a second member;
- and
- removing the carrier layer from the second member to form a connecting member between wiring films in which the bumps formed approximately in a cone-shape are embedded in the insulating film such that at least one ends of the bumps are projected therefrom.
A method of manufacturing a multilayer wiring substrate having wiring films on both surfaces thereof, comprising:
- arranging copper foils that serve as wiring films above and under a connecting member between wiring films having a plurality of bumps which are formed approximately in a cone-shape and which are embedded in an insulating film such that at least one ends of the bumps are projected therefrom;
- and
- integrating the insulating film and the copper foils through thermal pressing.
A method of manufacturing a multilayer wiring substrate having wiring films on both surfaces thereof, comprising:
- arranging members in which a metal foil is previously attached to a carrier layer and predetermined patterning is conducted thereto above and under a connecting member between wiring films having a plurality of bumps which are formed approximately in a cone-shape and which are embedded in an insulating film such that at least one ends of the bumps are projected therefrom;
- and
- integrating the insulating film, the bumps, the carrier layer, and the metal foil through thermal pressing.
A method of manufacturing a multilayer wiring substrate, comprising connecting wiring films of a double-sided wiring substrate or multilayer wiring substrate with wiring films of other double-sided wiring substrate or multilayer wiring substrate by a plurality of bumps which are formed approximately in a cone-shape and which are embedded in an insulating film such that at least one ends of the bumps are projected therefrom.
A method of manufacturing a multilayer wiring substrate, comprising:
- preparing a member in which a plurality of bumps formed approximately in a cone-shape are formed on one of principal surfaces of a carrier layer;
- laminating an insulating film for interlayer insulation on the one of principal surfaces of the carrier so as to make the insulating film be penetrated with the bumps;
- laminating a wiring film forming metal foil on an opposite surface of the insulating film to the carrier layer;
- removing the carrier layer;
- and
- laminating other wiring film forming metal foil, which is different from the wiring film forming metal foil, on the surface of the insulating film from which the carrier layer is removed to integrate the bumps, the insulating film, and the two wiring film forming metal foils.
A method of manufacturing a multilayer wiring substrate, comprising:
- preparing a member in which a plurality of bumps formed approximately in a cone-shape are formed on one of principal surfaces of a carrier layer that serves as an interlayer insulating film;
- obtaining a state where the bumps penetrate the carrier layer;
- and
- laminating wiring film forming metal foils on both surfaces of the carrier layer to integrate the carrier layer, the bumps, and the two wiring film forming metal foils.
A method of manufacturing a multilayer wiring substrate, comprising:
- preparing a member in which a plurality of bumps are formed on one of principal surfaces of a wiring film forming metal foil and other member in which an insulating film for interlayer insulation is laminated on one of principal surfaces of other wiring film forming metal foil and a plurality of bump corresponding holes are formed in the insulating film so as to correspond to the plurality of bumps;
- and
- performing alignment and lamination of the two members so as to make the respective bumps of the member correspond to the respective bump corresponding holes of the other member to integrate the bumps, the insulating film, and the two wiring film forming metal foils.
A method of manufacturing a multilayer wiring substrate, comprising:
- preparing a member in which a plurality of bumps are formed on one of principal surfaces of a mold and other member in which other mold is laminated on one of principal surfaces of an insulating film for interlayer insulation and bump corresponding holes are formed on the other mold so as to correspond to the bumps;
- facing the insulating film of the other member toward the surface of the member formed with the bumps on the side on which the bumps are formed so as to align the bump corresponding holes and the corresponding bumps with each other in position;
- pressing the two molds so as to make the insulating film be penetrated with the bumps;
- and
- removing the two molds and then laminating wiring film forming metal foils on both the surfaces of the insulating film to integrate the insulating film, the bumps, and the two wiring film forming metal foils.
A method of manufacturing a multilayer wiring substrate, comprising:
- performing half etching from one of principal surfaces of a bump forming metal foil to form a plurality of half bumps;
- laminating an insulating film for interlayer insulation on the one of principal surfaces of the bump forming metal foil so as to make the insulating film be penetrated with the half bumps;
- laminating a wiring film forming metal layer connected with the half bumps on a surface of the insulating film;
- performing half etching from the other principal surface of the bump forming metal foil to form other half bumps that are integrated with the half bumps to constitute bumps;
- laminating other insulating film for interlayer insulation on the other principal surface of the bump forming metal foil so as to make the other insulating film be penetrated with the other half bumps;
- and
- laminating other wiring film forming metal foil connected with the other half bumps on a surface of the other insulating film.
A method of manufacturing a multilayer wiring substrate, comprising:
- arranging above and under a wiring substrate comprised of a double-sided wiring substrate or multilayer wiring substrate connecting members between wiring films in which a plurality of bumps, which are formed approximately in a cone-shape, are embedded in an insulating film such that at least one ends of the bumps are projected therefrom;
- and
- arranging copper foils on an upper side of the upper connecting member between wiring films and on a lower side of the lower connecting member between wiring films and conducting pressing for their integration to connect wiring films of the wiring substrate comprised of the double-sided wiring substrate or multilayer wiring substrate with the copper foils.
A method of manufacturing a connecting member between wiring films, comprising:
- laminating a carrier layer on a bump forming metal foil;
- forming resist patterns to an opposite surface of the bump forming metal foil to the surface on which the carrier layer is laminated;
- conducting etching to the bump forming metal foil with the resist patterns serving as a mask to form a first member in which a plurality of bumps, which are formed approximately in a cone-shape, are projected from the carrier layer;
- laminating an insulating film on the first member so as to make top portions of the bumps be exposed from the insulating film to form a second member;
- removing the carrier layer from the second member to form a connecting member between wiring films;
- laminating other carrier layer different from the carrier layer on other bump forming metal layer different from the bump forming metal layer;
- forming other resist patterns different from the resist patterns to an opposite surface of the other bump forming metal foil to the surface on which the other carrier layer is laminated;
- conducting etching to the other bump forming metal foil with the other resist patterns serving as a mask to form other first member in which a plurality of bumps, which are formed approximately in a cone-shape, are projected from the other carrier layer;
- laminating the other first member and the connecting member between wiring films so as to make top portions of the bumps of the other first member be exposed from the insulating film of the connecting member between wiring films to form other second member different from the second member;
- and
- removing the other carrier layer from the other second member to form a new connecting member between wiring films in which bumps formed approximately in a cone-shape are embedded in an insulating film.
A method of manufacturing a multilayer wiring substrate, comprising:
- forming a conductive film to a connecting member between wiring films in which bumps formed approximately in a cone-shape are embedded in an insulating film;
- forming wiring patterns on the conductive film through plating;
- and
- removing the conductive film through quick etching.
A connecting member between wiring films, wherein a plurality of members, in which bumps formed approximately in a cone-shape are embedded in an insulating film, are laminated such that respective bumps are overlapped with one another.
Dependencies are inferred from the claim text.