Integrated circuit package

A computer system comprising:

• a processor connected to a bus;
• a memory connected to the bus;
• an input/output device connected to the bus;
• and
• an integrated circuit package in the processor, the memory device, or the input/output device, the integrated circuit package comprising:
• an integrated circuit formed in a die having an edge;
• a substrate;
• and
• a plurality of non-I/O columns bonded between the substrate and the die a selected distance from the edge of the die.

An integrated circuit package comprising:

• an integrated circuit having a metal mesh;
• a metal mesh formed in a substrate;
• and
• means for bonding the integrated circuit to the substrate.

A method comprising:

• forming an integrated circuit in a die having an edge;
• placing a plurality of first deformable adhesive bumps on the die in a high strain region of the die;
• placing a plurality of second deformable adhesive bumps on a surface of a substrate;
• aligning the first and second deformable adhesive bumps;
• and
• bonding the die to the substrate by reforming the first and second deformable adhesive bumps into a plurality of non-I/O columns bonded between the substrate and the die to reduce strain in the die.

A method for fabricating an integrated circuit package comprising:

• forming an integrated circuit and a metal mesh in the integrated circuit;
• forming a metal mesh in a substrate;
• and
• a step for bonding the integrated circuit to the substrate.

A method comprising:

• forming an integrated circuit in a die having a surface and an edge;
• placing a plurality of deformable adhesive bumps on the surface of the die a selected distance from the edge;
• bonding the die to a substrate through a plurality of deformable adhesive columns comprising the bumps;
• and
• placing underfill between the die and the substrate.