Solid-state imaging device, method for producing same, and mask
AssigneeSharp Kabushiki Kaisha
InventorsMasao Nakamura, Kazumasa Doi, Kouji Shidahara
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Abstract
The present invention provides a solid-state imaging device comprising: a transparent substrate transmitting light therethrough; a first chip including a solid-state imaging element having a light receiving portion; a first resin providing airtight sealing between the first chip and the transparent substrate; a second chip opposite to the transparent substrate with respect to the first chip; and second resin die bonding the second chip to the first chip, wherein the first resin and the second resin are made of the same material.
Claims7
A solid-state imaging device, comprising:
- a transparent substrate transmitting light therethrough;
- a first chip including a solid-state imaging element having a light receiving portion;
- a first resin providing airtight sealing between the first chip and the transparent substrate;
- a second chip opposite to the transparent substrate with respect to the first chip;
- and
- a second resin die bonding the second chip to the first chip,
- wherein the first resin and the second resin are made of the same material.
A method for producing a solid-state imaging device, comprising the steps of:
- mounting a first chip on a transparent substrate transmitting light therethrough, the first chip including a solid-state imaging element having a light receiving portion;
- placing a mask, which includes a recess portion for housing the first chip therein, a first opening, and a second opening, on the transparent substrate, such that the first chip is housed in the recess portion and prevents passage between the first and second openings, and thereafter injecting the same resin through the first and second openings to form first and second resins such that the first resin provides airtight sealing between the first chip and the transparent substrate and the second resin is separated from the first resin;
- die bonding the second chip to the first chip using the second resin;
- and
- curing each of the first resin and the second resin after die bonding of the second chip.
A mask covering a chip mounted on a transparent substrate, comprising:
- a recess portion for housing the chip therein;
- a first opening through which a first resin for providing airtight sealing between the chip and the transparent substrate is injected into the recess portion;
- and
- a second opening through which a second resin is injected so as to be separated from the first resin,
- wherein the chip prevents passage between the first and second openings.
Dependencies are inferred from the claim text.