Molded stiffener for thin substrates
AssigneeMicron Technology, Inc.
InventorsChad A. Cobbley, Cary J. Baerlocher
Life of this patent
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Abstract
A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.
Claims54
A semiconductor device comprising:
- a substrate;
- and
- a stiffener molded to the substrate.
A semiconductor device comprising:
- a substrate comprising a first surface, a second surface, and a periphery;
- and
- a stiffener molded to the first surface of the substrate proximate the periphery.
A semiconductor device comprising:
- a substrate comprising a first surface and a second surface;
- a first stiffener molded to the first surface of the substrate;
- and
- a second stiffener molded to the second surface of the substrate.
A semiconductor assembly comprising:
- a substrate having a first surface, a second surface, and a periphery;
- a die disposed on the first surface of the substrate;
- and
- a stiffener molded to the first surface of the substrate.
A semiconductor die package comprising:
- a substrate comprising a first surface, a second surface, and a periphery;
- a die disposed on the first surface of the substrate within the periphery;
- a stiffener molded to the first surface of the substrate at the periphery;
- and
- an encapsulating material covering the die.
A method of securing a stiffener to a substrate comprising the steps of:
- providing a stiffener material and the substrate, the substrate comprising a first surface, a second surface, and a periphery;
- molding the stiffener material to the first surface of the substrate proximate the periphery;
- and
- permitting the stiffener material to harden to form a molded stiffener secured to the substrate.
A method of molding a stiffener to a lead frame assembly comprising the steps of:
- providing the lead frame assembly, the lead frame assembly comprising a substrate having a first surface, a second surface, and a periphery, and two or more die disposed on the first surface of the substrate;
- providing a stiffener material;
- molding the stiffener material to the first surface of the substrate to form a molded stiffener;
- and
- singulating the lead frame assembly, having the molded stiffener thereon, to separate the two or more die.
A method of forming a semiconductor die package comprising the steps of:
- securing a die to a first surface of a substrate;
- molding a stiffener material to the first surface of the substrate to form a molded stiffener thereon;
- and
- encapsulating the die and the molded stiffener with an encapsulating material to form the semiconductor die package.
A method of forming a semiconductor die package comprising the steps of:
- mounting a die on a first surface of a lead frame;
- molding a stiffener to the first surface of the lead frame;
- applying an encapsulating material to the die and the stiffener;
- and
- permitting the encapsulating material to harden to produce the semiconductor die package.
Dependencies are inferred from the claim text.