Lead frame for a semiconductor device and a semiconductor device incorporating the lead frame

A semiconductor device comprising:

• (a) a lead frame having opposite first and second sides bounded respectively by first and second substantially parallel reference planes between which a thickness is defined, the lead frame comprising:
• a support having a surface at the first side of the lead frame;
• and
• a plurality of leads spaced from the support,
• a first lead in the plurality of leads having a length between first and second ends and a width taken transversely to the length,
• the first end of the first lead having a first region that has a thickness less than the thickness of the first lead at the second end of the first lead so that at least a part of the first region is offset from the second reference plane toward the first reference plane,
• the first end of the first lead having at least a first protrusion projecting away from the first reference plane;
• (b) a semiconductor chip mounted on the support surface;
• (c) a conductive element electrically connecting the semiconductor chip to the first lead;
• and
• (d) a sealing material covering the semiconductor chip and applied to a surface of the first lead between the first and second ends of the first lead between the first and second reference planes and at the first region of the first lead so that the second end of the first lead is exposed.