Optoelectronic semiconductor component
AssigneeOSRAM GmbH
InventorsKarlheinz Arndt, Herbert Brunner, Franz Schellhorn, Gunter Waitl
Life of this patent
Estimating the term…
Abstract
A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.
Claims8
A semiconductor component which performs at least one of a radiation-emitting function and a radiation-receiving function, comprising:
- a lead frame having an electrically conductive chip carrier part;
- a trough formed in the chip carrier part having a reflective inner surface;
- a semiconductor chip secured in the trough of the chip carrier part wherein radiation which is at least one of emitted and received by the semiconductor chip is reflected by the reflective inner surface of the trough;
- an encapsulation surrounding the semiconductor chip and at least a portion of the chip carrier part;
- and
- at least two first external connections projecting from the encapsulation, said at least two first external connections being directly connected to the chip carrier part.
A semiconductor component which performs at least one of a radiation-emitting function and a radiation-receiving function, comprising:
- a lead frame having a chip carrier part;
- a trough formed in the chip carrier part having a reflective inner surface;
- a semiconductor chip secured in the trough of the chip carrier part wherein radiation which is at least one of emitted and received by the semiconductor chip is reflected by the reflective inner surface of the trough;
- an encapsulation surrounding the semiconductor chip and at least a portion of the chip carrier part;
- and
- at least two first external connections projecting from the encapsulation, said at least two first external connections being directly connected to the chip carrier part, but not directly connected to the semiconductor chip.
A semiconductor component which performs at least one of a radiation-emitting function and a radiation-receiving function, comprising:
- a lead frame having a chip carrier part;
- a trough formed in the chip carrier part having a reflective inner surface;
- a semiconductor chip located directly above a bottom portion of the chip carrier part and secured in the trough of the chip carrier part wherein radiation which is at least one of emitted and received by the semiconductor chip is reflected by the reflective inner surface of the trough;
- an encapsulation surrounding the semiconductor chip and at least a portion of the chip carrier part;
- and
- at least two first external connections projecting from the encapsulation, said at least two first external connections being directly connected to the chip carrier part.
Dependencies are inferred from the claim text.