Light emitting diode and method of making the same
AssigneeUnited Epitaxy Company, Ltd.
InventorKuang-Neng Yang
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Abstract
A light emitting diode (LED) and a method of making the same are disclosed. The present invention uses a metal layer of high conductivity and high reflectivity to prevent the substrate from absorbing the light emitted. This invention also uses the bonding technology of dielectric material thin film to replace the substrate of epitaxial growth with high thermal conductivity substrate to enhance the heat dissipation of the chip, thereby increasing the performance stability of the LED, and making the LED applicable under higher current.
Claims28
A light emitting diode (LED), comprising:
- a LED epitaxial structure having a stacked epitaxial structure formed on a light-absorbing substrate;
- a substrate having high thermal conductivity coefficient;
- and
- an elastic dielectric adhesive material for bonding the substrate having high thermal conductivity coefficient and the LED epitaxial structure.
A method of making a light emitting diode, comprising:
- providing a LED epitaxial structure having a stacked epitaxial structure formed on a light-absorbing substrate;
- providing a substrate having high thermal conductivity coefficient;
- and
- using an elastic dielectric adhesive material to bond the substrate having high thermal conductivity coefficient and the LED epitaxial structure.
Dependencies are inferred from the claim text.