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US 2003/0155556 A1Published application
Adhesive and electric device
AssigneeSony Corporation
InventorYasushi Akutsu
Life of this patent
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Abstract
The particle diameter distribution of the filler material added to the adhesive of the invention has the first peak and the second peak positioned on a side of smaller particle diameters with respect to the first peak by 0.7μ or more, and thus the rigidity of the hardened adhesive is improved. Therefore, the connection reliability of the electric device 5 having the semiconductor chip 11 and the substrate 13 by using the adhesive (adhesive film 15) is improved.
Claims6
An adhesive comprising a filler material, electroconductive particles and a resin material,
- the filler material having a particle diameter distribution having a first peak and a second peak positioned on a side of smaller particle diameters with respect to the first peak, and
- a difference between a particle diameter, at which the first peak is positioned, and a particle diameter, at which the second peak is positioned, being 0.7 μm or more.
Dependencies are inferred from the claim text.