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US 2003/0155405 A1Published application
Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
AssigneeSeiko Epson Corporation
InventorTakuya Takahashi
Life of this patent
Estimating the term…
Abstract
A tip of a wire is bonded to a first electrode by using a tool. The wire is drawn from the first electrode to a bump on a second electrode. Apart of the wire is bonded to the center of the bump or a portion of the bump beyond the center in a drawing direction of the wire by using a part of the tool on a first electrode side in the drawing direction of the wire.
Claims23
A method of manufacturing a semiconductor device comprising steps of:
- (a) bonding a tip of a wire to a first electrode by using a tool;
- (b) drawing the wire from the first electrode to a bump on a second electrode;
- and
- (c) bonding a part of the wire to a center of the bump or a portion of the bump beyond the center along a drawing direction of the wire by using a part of the tool on a first electrode side.
1 more element
A semiconductor device comprising:
- a lead having a part which becomes a first electrode;
- a semiconductor chip which includes an integrated circuit, a second electrode, and a bump having a bottom end connected with the second electrode and a top end having an almost smooth surface;
- and
- a wire which has first and second ends, the first end being electrically connected with the first electrode and the second end being electrically connected with the bump,
- wherein the top end of the bump is formed so that a width of the top end is elongated in a drawing direction of the wire toward the bump and a height of the top end decreases as a distance from the wire increases along the drawing direction of the wire, and
- wherein the second end of the wire is connected with a center of the bump or a portion of the bump beyond the center along the drawing direction of the wire.
3 more elements
A semiconductor device comprising:
- a semiconductor chip which includes an integrated circuit and a first electrode;
- another semiconductor chip which includes an integrated circuit, a second electrode, and a bump having a bottom end connected with the second electrode and a top end having an almost smooth surface;
- and
- a wire which has first and second ends, the first end being electrically connected with the first electrode and the second end being electrically connected with the bump,
- wherein the top end of the bump is formed so that a width of the top end is elongated in a drawing direction of the wire toward the bump and a height of the top end decreases as a distance from the wire increases along the drawing direction of the wire, and
- wherein the second end of the wire is bonded to a center of the bump or a portion of the bump beyond the center along the drawing direction of the wire.
3 more elements
A circuit board having a semiconductor device mounted on the circuit board, the semiconductor device comprising:
- a lead having a part which becomes a first electrode;
- a semiconductor chip which includes an integrated circuit, a second electrode, and a bump having a bottom end connected with the second electrode and a top end having an almost smooth surface;
- and
- a wire which has first and second ends, the first end being electrically connected with the first electrode and the second end being electrically connected with the bump,
- wherein the top end of the bump is formed so that a width of the top end is elongated in a drawing direction of the wire toward the bump and a height of the top end decreases as a distance from the wire increases along the drawing direction of the wire, and
- wherein the second end of the wire is connected with a center of the bump or a portion of the bump beyond the center along the drawing direction of the wire.
3 more elements
A circuit board having a semiconductor device mounted on the circuit board, the semiconductor device comprising:
- a semiconductor chip which includes an integrated circuit and a first electrode;
- another semiconductor chip which includes an integrated circuit, a second electrode, and a bump having a bottom end connected with the second electrode and a top end having an almost smooth surface;
- and
- a wire which has first and second ends, the first end being electrically connected with the first electrode and the second end being electrically connected with the bump,
- wherein the top end of the bump is formed so that a width of the top end is elongated in a drawing direction of the wire toward the bump and a height of the top end decreases as a distance from the wire increases along the drawing direction of the wire, and
- wherein the second end of the wire is bonded to a center of the bump or a portion of the bump beyond the center along the drawing direction of the wire.
3 more elements
Electronic equipment comprising a semiconductor device which comprises:
- a lead having a part which becomes a first electrode;
- a semiconductor chip which includes an integrated circuit, a second electrode, and a bump having a bottom end connected with the second electrode and a top end having an almost smooth surface;
- and
- a wire which has first and second ends, the first end being electrically connected with the first electrode and the second end being electrically connected with the bump,
- wherein the top end of the bump is formed so that a width of the top end is elongated in a drawing direction of the wire toward the bump and a height of the top end decreases as a distance from the wire increases along the drawing direction of the wire, and
- wherein the second end of the wire is connected with a center of the bump or a portion of the bump beyond the center along the drawing direction of the wire.
3 more elements
Electronic equipment comprising a semiconductor device which comprises:
- a semiconductor chip which includes an integrated circuit and a first electrode;
- another semiconductor chip which includes an integrated circuit, a second electrode, and a bump having a bottom end connected with the second electrode and a top end having an almost smooth surface;
- and
- a wire which has first and second ends, the first end being electrically connected with the first electrode and the second end being electrically connected with the bump,
- wherein the top end of the bump is formed so that a width of the top end is elongated in a drawing direction of the wire toward the bump and a height of the top end decreases as a distance from the wire increases along the drawing direction of the wire, and
- wherein the second end of the wire is bonded to a center of the bump or a portion of the bump beyond the center along the drawing direction of the wire.
3 more elements
Dependencies are inferred from the claim text.